TDS, Inc.

330-724-3333
 

 

 

 

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Solder Paste:

Delta Solder Paste is a unique blend of low oxide, high purity solder powder with various paste flux formulations. Whether your surface mount assemblies require No-Clean, RMA (Rosin Mildly Activated), or Water-Soluble type solder paste, Qualitek can provide you with the right solder paste to achieve high productivity and reduce production cost.

Paste Packaging Options
Jar 3-4 oz. 250-500 grams
Semco & Pyle Cartridge., 6 oz., cartridge 700 grams & 12 oz., 1400 gms.
Syringe 10cc., Syringe 35gms. & 30cc., syringe 100 grams
DEK ProFlow 8 oz., Cassette 800 gms.

 

No-Clean Solder Paste (NC)
TYPE

Description

    

670I

 Robust Paste, provides good stencil life & excellent wetting.
 		 Tech. Data Msds
691A Designed for pin probability, soft residues spread from joints.
 		 Tech. Data Msds
XP692 Designed for pin probability, soft residues spread from joints, extended stencil life. high tack force and good wetting.
 		 Tech. Data Msds
818 Robust paste, provides good stencil life, excellent wetting and high tack force.
 		 Tech. Data Msds
615D Designed for syringe dispensing applications, providing excellent wetting and high tack force.
 		 Tech. Data Msds
619D Designed for syringe dispensing probable soft residues spread from joints high tack force and good wetting.
 		 Tech. Data Msds
No-Clean Solder Paste Comparison Chart
Formulations
Flux
Classification
RELO
RELO
RELO
RELO
RELO
 RELO
Post Reflow
Residues
4.5-5.0
4.0-4.5
4.0-4.5
5.0-5.5
6.0-6.5
 5.0-5.5
Standard Metal Load
90%
89%
90.2%
90%
88%
 88%
Application
Stencil
Printing
Stencil
Printing
Stencil
Printing
Stencil
Printing
Syringe
Dispensing
 Syringe
Dispensing

 

Water-Soluble Solder Paste (OA)
TYPE

Description

    

792

 Excellent wetting on a variety of metal surfaces.
 		 Tech. Data Msds
788 Excellent wetting on a variety of metal surfaces, with enhanced stencil life & tack.
 		 Tech. Data Msds
798 Ehibits environmental robustness, excellent wetting on a variety of metal surfaces.
 		 Tech. Data Msds
XP799 Excellent wetting with enhanced stencil & tack life, improved cleanability.
 		 Tech. Data Msds
XP779 Designed for syringe dispensing. Environmental robustness, enhanced slump, reduced void formation.
 		    
717D Designed for syringe dispensing. Excellent activity.

 

 Tech. Data Msds
Water-Soluble Solder Paste Comparison Chart
Formulations
792
788
798
XP799
XP779
717D
Flux
Classification
ORM0
ORL0
ORL0
ORL0
ORL0
 ORL0
Residue
Removal
DI Water
120-140F
DI Water
120-140F
DI Water
120-140F
DI Water
120-140F
DI Water
120-140F
DI Water
120-140F
Standard
Metal Load
90%
89%
89%
90%
90%
 87%
Application
Stencil
Printing
Stencil
Printing
Stencil
Printing
Stencil
Printing
Syringe
Dispensing
 Syringe
Dispensing

 

RMA & RA Solder Paste
TYPE

Description

    

230

 Excellent activity. Good printability
 		 Tech. Data Msds
350 Excellent activity. Good printability. For hard to solder surfaces.
 		 Tech. Data Msds
215D Designed for syringe dispensing. Excellent activity. Excellent dot to dot consistency.
 		 Tech. Data Msds
315D Designed for syringe dispensing applications. Excellent do to dot consistency.
 		 Tech. Data Msds
RA & RMA Solder Paste Comparison Chart
Formulations
230
350
215D
315D
Flux
Classification
ROL0
ROM1
ROL0
ROM0
Residue
Removal
Solvent
Semi-Aqueous
Solvent
Semi-Aqueous
Solvent
Semi-Aqueous
Solvent
Semi-Aqueous
Standard
Metal Load
90%
90%
86%
86%
Application
Stencil
Printing
Stencil
Printing
Syringe
Dispensing
Syringe
Dispensing

 

 

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